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Wolrd Class Provider of Micro Module Assembly and Thick Film and Thin Film Substrate Foundry Service, Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975. Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au. Tong Hsing's Direct Bonded Copper and Direct Plated Copper substrates are applied in ind.
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